Abstract

http://ssrn.com/abstract=1162226
 
 

References (57)



 
 

Citations (14)



 


 



The Agglomeration of US Ethnic Inventors


William R. Kerr


Harvard University - Entrepreneurial Management Unit

July 17, 2008

Harvard Business School Entrepreneurial Management Working Paper No. 09-003

Abstract:     
The ethnic composition of US inventors is undergoing a significant transformation - with deep impacts for the overall agglomeration of US innovation. This study applies an ethnic-name database to individual US patent records to explore these trends with greater detail. The contributions of Chinese and Indian scientists and engineers to US technology formation increase dramatically in the 1990s. At the same time, these ethnic inventors became more spatially concentrated across US cities. The combination of these two factors helps stop and reverse long-term declines in overall inventor agglomeration evident in the 1970s and 1980s. The heightened ethnic agglomeration is particularly evident in industry patents for high-tech sectors, and similar trends are not found in institutions constrained from agglomerating (e.g., universities, government).

Number of Pages in PDF File: 41

Keywords: Agglomeration, Innovation, Research and Development, Patents, Scientists, Engineers, Inventors, Ethnicity, Immigration

JEL Classification: F15, F22, J44, J61, O31

working papers series


Download This Paper

Date posted: July 17, 2008  

Suggested Citation

Kerr, William R., The Agglomeration of US Ethnic Inventors (July 17, 2008). Harvard Business School Entrepreneurial Management Working Paper No. 09-003. Available at SSRN: http://ssrn.com/abstract=1162226 or http://dx.doi.org/10.2139/ssrn.1162226

Contact Information

William R. Kerr (Contact Author)
Harvard University - Entrepreneurial Management Unit ( email )
Soldiers Field Road
Morgan 270C
Boston, MA 02163
United States
Feedback to SSRN


Paper statistics
Abstract Views: 993
Downloads: 135
Download Rank: 115,314
References:  57
Citations:  14
Paper comments
No comments have been made on this paper

© 2014 Social Science Electronic Publishing, Inc. All Rights Reserved.  FAQ   Terms of Use   Privacy Policy   Copyright   Contact Us
This page was processed by apollo2 in 0.328 seconds