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Biphilic Jumping-Droplet Condensation

82 Pages Posted: 4 Nov 2021 Publication Status: Published

See all articles by Muhammad Jahidul Hoque

Muhammad Jahidul Hoque

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering

Shreyas Chavan

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering

Ross Lundy

Nokia Bell Labs

Longnan Li

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering

Jingcheng Ma

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering

Xiao Yan

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering

Shenghui Lei

Nokia Bell Labs

Nenad Miljkovic

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering; University of Illinois at Urbana-Champaign - Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign - Department of Electrical and Computer Engineering; Kyushu University - International Institute for Carbon Neutral Energy Research (WPI-I2CNER)

Ryan Enright

Nokia Bell Labs

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Abstract

Jumping droplet condensation on superhydrophobic surfaces exhibit increased heat transfer rate compared to dropwise condensation on hydrophobic surfaces However, the performance of superhydrophobic surfaces is limited by the low individual droplet growth rates associated with their extreme apparent advancing contact angles (θapp → 180°). Our detailed condensation heat transfer modeling coupled with numerical simulations of binary (N = 2) and coordinated (N > 2) droplet coalescence, show that biphilic surfaces with smooth, low surface energy spots on a superhydrophobic background exhibit an unprecedented 10X higher jumping droplet condensation heat transfer coefficient when compared to homogenous superhydrophobic surfaces. By promoting faster droplet growth rates on these spots and controlling spot adhesion, we engineer the droplet distribution density on the surface while promoting droplet departure efficiency beyond what is currently available. Model predicted design optimization of the biphilic surface is validated against condensation experiments. Our findings clarify the role of droplet jumping dynamics and distribution densities by revealing optimum design guidelines for biphilic surface development for maximum condensation heat flux. Contrary to current understanding, we observe that spot wettability should not be optimized towards minimizing droplet nucleation energy barrier, rather it should minimize droplet adhesion while maximizing individual droplet growth rate.

Keywords: droplet, heat transfer, energy, superhydrophobic, adhesion, structured surfaces, biphilic, jumping

Suggested Citation

Hoque, Muhammad Jahidul and Chavan, Shreyas and Lundy, Ross and Li, Longnan and Ma, Jingcheng and Yan, Xiao and Lei, Shenghui and Miljkovic, Nenad and Enright, Ryan, Biphilic Jumping-Droplet Condensation. Available at SSRN: https://ssrn.com/abstract=3956661 or http://dx.doi.org/10.2139/ssrn.3956661
This version of the paper has not been formally peer reviewed.

Muhammad Jahidul Hoque

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering ( email )

601 E John St
Champaign, IL Champaign 61820
United States

Shreyas Chavan

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering ( email )

601 E John St
Champaign, IL Champaign 61820
United States

Ross Lundy

Nokia Bell Labs ( email )

21 J J Thomson Avenue
Cambridge, CB3 0FA
United Kingdom

Longnan Li

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering ( email )

601 E John St
Champaign, IL Champaign 61820
United States

Jingcheng Ma

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering ( email )

Xiao Yan

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering ( email )

601 E John St
Champaign, IL Champaign 61820
United States

Shenghui Lei

Nokia Bell Labs ( email )

21 J J Thomson Avenue
Cambridge, CB3 0FA
United Kingdom

Nenad Miljkovic

University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering ( email )

601 E John St
Champaign, IL 61820
United States

University of Illinois at Urbana-Champaign - Frederick Seitz Materials Research Laboratory ( email )

Urbana, IL
United States

University of Illinois at Urbana-Champaign - Department of Electrical and Computer Engineering ( email )

1406 West Green Street
Urbana, IL 61801
United States

Kyushu University - International Institute for Carbon Neutral Energy Research (WPI-I2CNER) ( email )

6-19-1, Hakozaki, Higashiku
Fukuoka, 812-8581
Japan

Ryan Enright (Contact Author)

Nokia Bell Labs ( email )

21 J J Thomson Avenue
Cambridge, CB3 0FA
United Kingdom

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