Achieving Improved Strength and Ductility Through Multi-Pass Cold Deformation and Annealing of a Cu-Zn-Bi Alloy

7 Pages Posted: 3 Oct 2022

See all articles by Shenglong Liang

Shenglong Liang

University of Science and Technology Beijing

Yihan Wang

University of Science and Technology Beijing

H. Wang

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Jun Wang | WANG

Sichuan University

Suihe Jiang

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Abstract

In this work, a simple-yet-powerful processing method was applied successfully to a Bi-containing brass alloy (Cu–30wt.%Zn–3wt.%Bi), which utilized multi-pass proper annealing following medium-strain cold-rolling deformation. Both strength and ductility of the alloy have been improved simultaneously. This is mainly due to the redistribution of the bulky Bi phase along the rolling plane as well as the grain refinement of the brass matrix. Bi phase pancaking reduces the possibility of cracking at the early stages during straining whilst grain size refines continuously cycle-by-cycle, and the matrix is strengthened. The processing method could be applied to other alloys with similar microstructure.

Keywords: Metals and alloys, Bi-containing brass, microstructure, Cold-rolling, Recrystallization

Suggested Citation

Liang, Shenglong and Wang, Yihan and Wang, H. and Wang | WANG, Jun and Jiang, Suihe, Achieving Improved Strength and Ductility Through Multi-Pass Cold Deformation and Annealing of a Cu-Zn-Bi Alloy. Available at SSRN: https://ssrn.com/abstract=4236461

Shenglong Liang (Contact Author)

University of Science and Technology Beijing ( email )

30 Xueyuan Road, Haidian District
beijing, 100083
China

Yihan Wang

University of Science and Technology Beijing ( email )

30 Xueyuan Road, Haidian District
beijing, 100083
China

H. Wang

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering ( email )

30 Xueyuan Road, Haidian District
Beijing, 100083
China

Jun Wang | WANG

Sichuan University ( email )

Suihe Jiang

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Do you have a job opening that you would like to promote on SSRN?

Paper statistics

Downloads
29
Abstract Views
115
PlumX Metrics