Xianhua Li

Guizhou University

Guizhou

China

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Process Parameter Optimization and IMC Growth Behavior in Cu–Ni Dissimilar-Metal Thermocompression bonding Based on Response Surface Methodology and Molecular Dynamics Simulations

Number of pages: 32 Posted: 27 Jan 2026

Xingyang Xu, Jiadui Chen, Kai Yang, Wei Li, Haisong Huang, Xianhua Li and Jingwei Yang

Guizhou University, Guizhou University, Guizhou University, Guizhou University, Guizhou University, Guizhou University and Foshan University

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