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MIchael Farnsworth

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Scholarly Papers (1)

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Process Monitoring of Thermal Crimping Systems using Sensorisation and Machine Learning

Number of pages: 30 Posted: 13 Feb 2026
Ioan-Alexandru Herdea, Divya Tiwari, Ashutosh Tiwari, MIchael Farnsworth, Geraint W. Jewell and Alexis Lambourne
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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Non-destructive defect detection, Infrared thermography, YOLO object detection, LSTM, Thermal crimping, Bimodal quality prediction