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Siyang Mei
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SCHOLARLY PAPERS
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Scholarly Papers (1)
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1.
In situ EBSD investigation of deformation in annealed copper during tensile test
Number of pages: 16
Posted: 24 Feb 2026
Fengning Liu
,
Jiaguan Peng
, Siyang Mei,
Zhenhua Zhao
,
Yun-Zhe Jiang
,
Mengqi Zhang
,
Qiannan Yu
,
Tiangang Zhang
,
Hongxian Xie
,
Long Cheng
,
Sijie Hao
,
Yue Yuan
and
Guanghong Lu
affiliation not provided to SSRN
, Beihang University (BUAA),
affiliation not provided to SSRN
, China Institute of Nuclear Industry Strategy,
affiliation not provided to SSRN
,
affiliation not provided to SSRN
,
affiliation not provided to SSRN
,
affiliation not provided to SSRN
, Hebei University of Technology, Beihang University (BUAA), Beihang University (BUAA), Beihang University (BUAA) and Beihang University (BUAA)
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Abstract:
Copper, heat sink materials, annealing, in situ EBSD, tensile test
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