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Jian-qiang Luo

affiliation not provided to SSRN

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Ag-doped TiO2 Catalytic Seed Layer for High-performance Electroless Copper Plating on YIG Ferrite Substrates

Number of pages: 32 Posted: 18 Apr 2026
Kai-long Li, Guo-liang Liu, Jian-qiang Luo, Hao-wen Zhang, Di-wen Jiang, Hai-jun Chen, Zhe-sheng Feng and Yan Wang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN, Xihua University, University of Electronic Science and Technology of China (UESTC) and University of Electronic Science and Technology of China (UESTC)
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Abstract:

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Yttrium iron garnet, Electroless copper plating, Surface modification, catalytic seed layer, Ag-doped TiO2