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Wenjia Huang

affiliation not provided to SSRN

SCHOLARLY PAPERS

1

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Scholarly Papers (1)

1.

Residual Stress Analysis in Wire Arc Cladding: Influence of Cladding Material, Interpass Temperature and Thickness Parameter

Number of pages: 32 Posted: 13 May 2026
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Wollongong - School of Mechanical, Materials, Mechatronic and Biomedical Engineering, Tsinghua University and The University of Osaka
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Abstract:

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Wire Arc Cladding, Residual stress, Thickness effect, Interpass Temperature