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Mingqi Zhang

Wuhan University of Technology

Wuhan, 430063

China

  • Wuhan University of Technology

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Scholarly Papers (1)

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Feasibility of Low-Cost Packaging for Micro TEC: Reaction mechanism and Reliability Limits of Sn-Sb Alternative to Au-Sn Solders

Number of pages: 27 Posted: 20 May 2026
Dongwang Yang, Jianan Lyu, Tingting Su, Mingqi Zhang, Zinan Zhang, Yuhan Bao, Xinfeng Tang and Yonggao Yan
Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology and Wuhan University of Technology
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Bi2Te3 based thermoelectric device, Sn-Sb solder, Au-Sn solder, reliability