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Shengyu Wu

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Three-dimensional dual-network Ni@Co3O4 foam embedded with silver flakes for electromagnetic shielding and thermal management

Number of pages: 10 Posted: 29 Jun 2026
Binkai Hu, Qi Zeng, Shihua Yang, Shengyu Wu, Xinlei Wang, Bin Li and Chunjin Hang
Shanghai University of Engineering Science, Shanghai University of Engineering Science, affiliation not provided to SSRN, affiliation not provided to SSRN, Shanghai University of Engineering Science, Shanghai University of Engineering Science and Harbin Institute of Technology
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Electromagnetic shielding, Thermal management, Metal foams, composite materials