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Seongpil An

University of Illinois at Chicago

1200 W Harrison St

Chicago, IL 60607

United States

  • University of Illinois at Chicago

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Scholarly Papers (1)

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In Vitro Evaluation of Pt-Coated Electrospun Nanofibers for Endovascular Coil Embolization

Number of pages: 26 Posted: 10 Jul 2019
Min-Woo Kim, Seongpil An, Hyunjun Seok, Hyunchul Jung, Dong-Hyuk Park, Alexander L. Yarin and Sam S. Yoon
Korea University - School of Mechanical Engineering, University of Illinois at Chicago, Korea University - School of Mechanical Engineering, E-eung, E-eung, University of Illinois at Chicago and Korea University - School of Mechanical Engineering
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Endovascular coil embolization, Aneurysm, Electrospinning, Platinum nanofiber, Permeability