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Kurt Matoy
Infineon Technologies Austria AG
Austria
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Scholarly Papers (1)
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1.
Au-Sn Solders Applied in Transient Liquid Phase Bonding: Microstructure and Mechanical Behavior
Number of pages: 27
Posted: 14 Aug 2019
Chaowei Du
,
Rafael Soeler
,
Bernhard Völker
, Kurt Matoy,
Johannes Zechner
,
Gregor Langer
,
Michael Reisinger
,
Juraj Todt
,
Christoph Kirchlechner
and
Gerhard Dehm
Max Planck Institute for Iron Research, Max Planck Institute for Iron Research, Max Planck Institute for Iron Research, Infineon Technologies Austria AG, Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik, Infineon Technologies Austria AG, Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik, University of Vienna - Erich Schmid Institute of Materials Science, Max Planck Institute for Iron Research and Max Planck Institute for Iron Research
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Abstract:
Au-Sn solder, micro-cantilever testing, micro-bending, fracture toughness
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