Johannes Zechner

Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik

Austria

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Scholarly Papers (1)

1.

Au-Sn Solders Applied in Transient Liquid Phase Bonding: Microstructure and Mechanical Behavior

Number of pages: 27 Posted: 14 Aug 2019
Max Planck Institute for Iron Research, Max Planck Institute for Iron Research, Max Planck Institute for Iron Research, Infineon Technologies Austria AG, Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik, Infineon Technologies Austria AG, Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik, University of Vienna - Erich Schmid Institute of Materials Science, Max Planck Institute for Iron Research and Max Planck Institute for Iron Research
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Abstract:

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Au-Sn solder, micro-cantilever testing, micro-bending, fracture toughness