Korea, Republic of (South Korea)
Korea Institute of Industrial Technology (KITECH) - Gangwon Regional Division
AM (additive manufacturing), 3D printing, Rapid prototyping, DMLS, AlSi10Mg powder
Fe‒Cu alloys, Electron-beam powder bed fusion, Cu particles, Lack-of-fusion defects, Micro-crack, residual stress
selective laser melting, surface roughness, down surface, melt pool, energy density
Ti-6Al-4V, Powder Metallurgy, Hot isostatic pressing, Powder size, below β transus temperature
Ti-6Al-4V, Powder metallurgy, Hot isostatic pressing, Powder size, below β transus temperature
Selective laser melting SUS316L High density Energy density Property tuning
Laser powder bed fusion, High productivity, Optimal hatch spacing, Commercially pure titanium, Fully dense
Fe-10Cu, Hot isostatic pressing, BCC Cu, Mechanical properties, precipitation
Additive manufacturing, Selective Laser Melting, copper, post treatment, Hot Isostatic Pressing
additive manufacturing, selective laser melting, niobium, Energy density, hot isostatic pressing
Selective Laser Melting, CoCrMo, rescanning, residual stress, mechanical properties, Energy density
Pure Cu, dynamic recrystallization, hot isostatic pressing, dislocation, work hardening
Additive Manufacturing, selective laser melting, Titanium, stress relief, residual stress
Selective laser melting, Hot isostatic pressing, Si precipitation, Internal pores, Residual stress
additive manufacturing, Selective Laser Melting, Titanium, Energy density, Down surface
Additive Manufacturing, laser powder bed fusion, titanium, Energy density, Layer thickness
Selective Laser Melting, Hot isostatic pressing, SUS316L-10Cu alloy, Energy density, Mechanical properties
Additive Manufacturing, Laser bed fusion, Hot isostatic pressing, Inconel 718, microstructural evolution, mechanical properties
Tungsten, Activation energy, Grain Growth, Sintering, Hot isostatic pressing
Selective laser melting, Ti-6Al-4V, Residual stress, Stress relief, Beta transus temperature
Fe–Cu alloy, Two-step HIP, Initial microstructure, Grain growth behavior, Strength–ductility transition, Cu precipitates.
Fe-Cu alloy, Two-step HIP, Initial microstructure, Grain growth behavior, Strength-ductility transition, Cu precipitates.
