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Guanghong Huang

Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials

Beijing

China

SCHOLARLY PAPERS

2

DOWNLOADS

149

TOTAL CITATIONS

0

Scholarly Papers (2)

1.

Microstructure Evolution, Thermal Properties Improvement and Failure Mechanism of Thermal Barrier Coatings After Shot Peening

Number of pages: 30 Posted: 01 Nov 2021
Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials and Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials
Downloads 79 (823,616)

Abstract:

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thermal barrier coatings, Shot peening, Interface microstructure, Thermal shock life, Failure mechanism

2.

LaYZrO/YSZ Double Ceramic Layer Thermal Barrier Coatings by EB-PVD: Thermal Performance, Morphology and Failure Behavior

Number of pages: 30 Posted: 13 Sep 2022
Guanxi Liu, Zaoyu Shen, Limin He, Rende Mu and Guanghong Huang
Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials, Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials and Aero Engine Corporation of China - Key Laboratory of Advanced Corrosion and Protection for Aviation Materials
Downloads 70 (883,195)

Abstract:

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TBCs, LaYZrO/YSZ, thermal conductivity, failure behavior, TGO