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Fengmei Liu

affiliation not provided to SSRN

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Growth Mechanisms of Intermetallic Compounds and Bi-Rich Layer in Ball Grid Array Structure Cu/Sn-58Bi/Cu Solder Joints During Solid-Solid and Liquid-Solid Electromigration

Number of pages: 32 Posted: 30 Dec 2021
Jiaqiang Huang, Xudong Wang, Junyu Chen, Weichun Wei, Fengmei Liu, Binhao Qin, Haiyan Wang and Yupeng Zhang
Guilin University of Electronic Technology, Guilin University of Electronic Technology, Guilin University of Electronic Technology, Guilin University of Electronic Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, Guangdong Academy of Sciences (GDAS) - China-Ukraine Institute of Welding and affiliation not provided to SSRN
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Sn-58Bi, Electromigration, Interfacial Reaction, Bi-Rich Layer, Reliability