Lei Chen

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Scholarly Papers (1)

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Effects of Solution Temperatures on the Microstructure and Properties of a Copper Alloy by Semisolid Back Extrusion

Number of pages: 21 Posted: 15 Feb 2022
Lei Chen, Han Xiao, Xiongchao Zhang, Zhike Duan, Lei Chen, Yongkun Li and Rongfeng Zhou
affiliation not provided to SSRN, Kunming University of Science and Technology - Faculty of Materials Science and Engineering, Kunming University of Science and Technology, affiliation not provided to SSRN, Kunming University of Science and Technology, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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Semi solid back-extruded, Copper alloy, Solution treatment, Mechanical property, Corrosion resistance