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Cong Xiong

Wuhan University of Technology

Wuhan, Wuhan 430063

China

  • Wuhan University of Technology

SCHOLARLY PAPERS

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Microstructure Transformation and Mechanical Properties of Al Alloy Joints Soldered with Ni-Cu Foam/ Sn-3.0ag-0.5cu (Sac305) Composite Solder

Number of pages: 26 Posted: 15 Feb 2022
Cong Xiong, Yong Xiao, Jian Zhang and Dan Luo
Wuhan University of Technology, Wuhan University of Technology - School of Material Science and Engineering, Wuhan University of Technology and University of Sheffield
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Citation 10

Abstract:

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Foam reinforced solders, Ni-Cu-Sn composite solder, Al joint, Solid-phase transitions, Microstructure, Mechanical properties