Wei He

Nanjing University of Science and Technology

No.219, Ningliu Road

Nanjing, 210094

China

  • Nanjing University of Science and Technology

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Scholarly Papers (1)

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Multi-Objective Optimization for Heat Transfer Performance of Micro-Fins and Signal Integrity of Key Interconnect Technologies in 3d Integrated Chips

Number of pages: 23 Posted: 16 Feb 2022
Wei He, Ershuai Yin and Qiang Li
Nanjing University of Science and Technology, Nanjing University of Science and Technology and Nanjing University of Science and Technology
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Abstract:

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3D integrated chips, Thermal Management, Signal integrity, through-silicon via (TSV), Electrothermal coupling, Multi-objective optimization