Huiying Rd
DaLian, LiaoNing, 116024
China
Dalian University of Technology
TC4, GH4169, Ti-Cu IMCs, Copper foil, Shear strength, Nano-hardness
A.Aluminides, A.Nucleation and growth, B.Diffusion, D.Microstructure, D.Interfaces, F.Electron microscopy, scanning
GH4169D, Vacuum brazing, Cu2NiZn ordered solid solution, First-principles calculation
Dissimilar materials joining, Microregion, High-temperature oxidation, Oxide film structure
GH4169, Ti60, Cu foil, Zr foil, Shear strength, diffusion bonding