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Mengfei Qin

Dalian University of Technology

Huiying Rd

DaLian, LiaoNing, 116024

China

SCHOLARLY PAPERS

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Scholarly Papers (1)

1.

Molecular Dynamics Simulation Analysis of the Stress Around an Up-Migrating Helium Bubble Under Tungsten Surface and its Bursting

Number of pages: 13 Posted: 17 Feb 2022
affiliation not provided to SSRN, Dalian University of Technology, Dalian University of Technology - Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams, Dalian University of Technology and affiliation not provided to SSRN
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Abstract:

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Molecular Dynamics, Helium bubble, tungsten surface