default author photo

Fei Diao

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

1

DOWNLOADS

167

TOTAL CITATIONS

1

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Additively Manufactured Flow Manifolds Enable High Performance Direct Cooling for High Density Power Electronics

Number of pages: 47 Posted: 16 Mar 2022
Aniket Ajay Lad, Ashrit Tayade, Muhammad Jahidul Hoque, Mohammad Hazzaz Mahmud, Fei Diao, Yuheng Wu, Yue Zhao, Juan Carlos Balda, William P. King and Nenad Miljkovic
affiliation not provided to SSRN, affiliation not provided to SSRN, University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Illinois at Urbana-Champaign and University of Illinois at Urbana-Champaign - Department of Mechanical Science and Engineering
Downloads 167 (459,428)
Citation 1

Abstract:

Loading...

Electronics cooling, Thermal Management, Additive manufacturing, electromagnetic interference, channel flow, direct cooling, single-phase liquid cooling