Fei Wang

Kunming University of Science and Technology

Kunming Yunnan China

Kunming

China

SCHOLARLY PAPERS

3

DOWNLOADS

81

TOTAL CITATIONS

0

Scholarly Papers (3)

Selection Mechanism of Synergistic Effect between Dielectric Barrier Discharge Plasma and Cu/Γ-Al2o3 Catalyst in Carbonyl-Sulfide Conversion: Electric Field Changes Energy Barrier and Reaction Path

Number of pages: 26 Posted: 27 Apr 2022
Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 18 (1,238,277)

Abstract:

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Carbonyl sulfide, Cu/γ-Al2O3 catalyst, Dielectric barrier discharge, Plasma-catalysis, Gaussian

2.

Optimization of Transition Metal Modified H-Zsm-5 Adsorbent for Low-Temperature Removal of Methyl Mercaptan

Number of pages: 28 Posted: 23 Jul 2022
Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 33 (1,020,755)

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Methyl mercaptan, Adsorption, Transition metal, Cu modified adsorbent, Sulfur deposition

3.

Low-Temperature Efficient Removal of Ph3 Over Novel Cu-Based Adsorbent in an Anaerobic Environment

Number of pages: 24 Posted: 23 Dec 2022
Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 30 (1,053,946)

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copper-based materials, phosphine, Adsorption, Cu3P