affiliation not provided to SSRN
Thermal management system, downhole electronics, active cooling, passive cooling, thermal insulation
Thermal contact resistance, thermal interface material, low melting temperature alloy
evaporation coefficient, phase change model, temperature deviation, VOF
tall fin, cycloid thermosyphon loop, evaporation and condensation, blind channels, thermal resistance, liquid level
Subcooled boiling, Flexible tails, Heat transfer, Pillar-array microchannels.
