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Woosung Jo

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Thermally Stable and Soft Pressure-Sensitive Adhesive for Foldable Electronics

Number of pages: 26 Posted: 16 May 2022
TaekSoo Kim, Woosung Jo, Kihoon Jeong, Young-Sam Park, Jeong-Ik Lee and Sung Gap Im
Korea Advanced Institute of Science and Technology (KAIST) - Department of Mechanical Engineering, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Korea Advanced Institute of Science and Technology (KAIST)
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Abstract:

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pressure-sensitive adhesive (PSA), initiated chemical vapor deposition (iCVD), Thermal Stability, multiple neutral planes, delamination, foldable electronics