Wei Wang

affiliation not provided to SSRN

No Address Available

SCHOLARLY PAPERS

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2

Scholarly Papers (1)

1.

Material Removal Mechanism and Mechanical Model of Ultrasonic Vibration Empowered Minimum Quantity Lubrication Grinding for Cfrp

Number of pages: 49 Posted: 15 Apr 2024
Qingdao University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, Qingdao University of Technology, Qingdao University of Technology, Dalian University of Technology, affiliation not provided to SSRN and Qingdao University of Technology
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Citation 2

Abstract:

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Grinding, CFRP, Ultrasonic vibration, Mechanical Model, Minimum quantity lubrication