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Man Yang

Chongqing University of Science and Technology

China

  • Chongqing University of Science and Technology

SCHOLARLY PAPERS

2

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75

TOTAL CITATIONS

2

Scholarly Papers (2)

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1.

Effects of Ni-Decorated Reduced Graphene Oxide Nanosheets on the Microstructural Evolution and Mechanical Properties of Sn-3.0ag-0.5cu Composite Solders

Number of pages: 27 Posted: 13 Jun 2022
Hehe Zhang, Yuchen Xiao, Ziqi Xu, Man Yang, Liping Zhang, Limeng Yin, Sensen Chai, Gang Wang, Long Zhang and Xinnan Cai
Chongqing University of Science and Technology, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology and affiliation not provided to SSRN
Downloads 47 (1,109,210)
Citation 2

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Lead-free composite solders, Eutectic Sn-Ag-Cu alloy, Ni-decorated reduced graphene oxide, microstructure, Mechanical performance

2.

Formation Mechanism for the Interface between Cu And Sn Formed By Electromagnetic Pulse Welding

Number of pages: 17 Posted: 22 Feb 2023
Hehe Zhang, Man Yang, Tiantian Tan, Chunjiang Guo, Limeng Yin, Long Zhang, Sensen Chai, Liping Zhang, Huiyi Tang and Yuchen Xiao
Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, Chongqing University of Science and Technology, affiliation not provided to SSRN and Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering
Downloads 28 (1,345,526)

Abstract:

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Magnetic pulse welding, Microstructure, Gradient nanograined interface, Copper/tin, Secondary solid solution