Institute of Mathematical Sciences, Faculty of Sci
University of Malaya, Lembah Pantai
Kuala Lumpur, 50603
Malaysia
University of Malaya (UM)
multicomponent solder, Tensile strength, SAC305, thermal aging, Microstructure
multicomponent solder, tensile strength, SAC305, thermal aging, Microstructure
low cycle fatigue, nodular cast iron, ductile, hardening, softening