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Tamás Hurtony

Budapest University of Technology and Economics

Budafoki ut 8.

Budapest, 1111

Hungary

SCHOLARLY PAPERS

1

DOWNLOADS

46

TOTAL CITATIONS

2

Scholarly Papers (1)

1.

Impact of Electromigration and Isothermal Ageing on Lead-Free Solder Joints of Chip-Sized Smd Components

Number of pages: 16 Posted: 27 Jun 2022
Dániel Straubinger, Tamás Hurtony and Attila Géczy
Budapest University of Technology and Economics, Budapest University of Technology and Economics and Budapest University of Technology and Economics - Department of Electronics Technology
Downloads 46 (1,109,210)
Citation 2

Abstract:

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electromigration, solder joint, intermetallics, reflow soldering, reliability