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Colin Teoh

Singapore University of Technology and Design (SUTD)

8 Somapah Road

487372

Singapore

  • Singapore University of Technology and Design (SUTD)

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Scholarly Papers (1)

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Increasing the Adhesion of W to Si Substrates Using Cr/Ti Interlayers

Number of pages: 10 Posted: 07 Jul 2022
Matthew James Lloyd, Colin Teoh, Glenn Lim, Duc Nguyen-Manh, Damian Sobieraj, Jan S. Wróbel and Robert E. Simpson
Singapore University of Technology and Design (SUTD) - Pillar of Engineering Product Development, Singapore University of Technology and Design (SUTD), Singapore University of Technology and Design (SUTD), Culham Science Centre - United Kingdom Atomic Energy Authority, Warsaw University of Technology - Faculty of Materials Science and Engineering, Warsaw University of Technology - Faculty of Materials Science and Engineering and Singapore University of Technology and Design (SUTD)
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Tungsten chromium alloys, Nuclear Fusion, rapid prototyping, Density functional theory