Ni-W, Counterpart materials, Delamination, Tribo-layer
Magnesium alloy, Scandium, Stress-induced martensitic transformation, Hexagonal close-packed structure, Substructure
Mg-Sc alloy, Quenching temperature, Microhardness, Compressive properties, Microstructure
Co-Mo layer, Cu/Sn solder, electrodeposition, Barrier performance
Magnesium alloy, Scandium, Stress-induced martensitic transformation, Hexagonal close-packed structure, Substructure.
In-situ polymerization, transparent, Superhydrophobic, self-cleaning, Anti-icing
Illuminance, Electrodeposition, silicone- acrylic resin, cerium, Coatings