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Guoping Wang

Hefei University of Technology

193 Tunxi Rd

Baohe

Hefei

China

  • Hefei University of Technology

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Scholarly Papers (1)

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On the Use of Cocrfeni High Entropy Alloy as a New Interlayer for Achieving High Strength Diffusion Bonded Tungsten/Steel Joint

Number of pages: 18 Posted: 30 Aug 2022
Chunyan Wang, Zhihao Xiong, Kuijing Song, Yucheng Wu, Guoping Wang and Zhihong Zhong
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology - School of Materials Science and Engineering, Hefei University of Technology and Hefei University of Technology
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Abstract:

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Tungsten, steel, Diffusion bonding, Interlayer, Interfacial microstructure, Mechanical properties