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Elisa Isotahdon

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

3

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137

TOTAL CITATIONS

0

Scholarly Papers (3)

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1.

Penetration of Corrosive Species into Copper Exposed to Simulated O2-Free Groundwater Revealed by Time-of-Flight Secondary Ion Mass Spectroscopy (Tof-Sims)

Number of pages: 23 Posted: 20 Sep 2022
Xiaoqi Yue, Per Malmberg, Elisa Isotahdon, Vilma Ratia, Elina Huttunen-Saarivirta, Christofer Leygraf and Jinshan Pan
University of Science and Technology Beijing, Chalmers University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, VTT Technical Research Centre of Finland, affiliation not provided to SSRN and Royal Institute of Technology (KTH)
Downloads 70 (875,328)

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Copper, sulfide corrosion, ground water, ToF-SIMS, corrosive species, microstructure

2.

Pitting Corrosion on Highly Alloyed Stainless Steels in Dilute Sulphuric Acid Containing Sodium Chloride

Number of pages: 54 Posted: 17 Nov 2022
Elina Huttunen-Saarivirta, Elisa Isotahdon, Z. Que, M. Lindgren, A. Mardoukhi, J.-B. Jorcin, P. Mocnik, T. Kosec, Y. El Ouazari, S. Hägg Mameng and L. Wegrelius
VTT Technical Research Centre of Finland, affiliation not provided to SSRN, VTT Technical Research Centre of Finland, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Slovenian National Building and Civil Engineering Institute, Slovenian National Building and Civil Engineering Institute, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 50 (1,063,489)

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Stainless steel, austenitic, duplex, pitting attack, passivity breakdown

3.

Characterization of Surface Films that Develop on Pre-Oxidized Copper in Anoxic Simulated Groundwater with Sulphide

Number of pages: 40 Posted: 14 Jun 2023
Elina Huttunen-Saarivirta, V. Ratia-Hanby, Elisa Isotahdon, Xiaoqi Yue, Per Malmberg, Christofer Leygraf and Jinshan Pan
VTT Technical Research Centre of Finland, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Science and Technology Beijing, Chalmers University of Technology, affiliation not provided to SSRN and Royal Institute of Technology (KTH)
Downloads 17 (1,481,165)

Abstract:

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Copper, surface film, copper sulphide, cuprous oxide, thickness