Xiamen, 361005
China
Xiamen University
Soldering, Electromigration, Anisotropy, Electron backscatter diffraction (EBSD), Grain rotation
Soldering, Particle, Microstructure formation mechanism, Orientation, Thermal conductivity
Composite material, Stretchable material, Electromagnetic interference shielding
SnBi alloys, Microstructure, Tensile properties, Thermal conductivity, Electrical conductivity, Fracture