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Ying Zhao

Hong Kong University of Science & Technology (HKUST)

SCHOLARLY PAPERS

3

DOWNLOADS

152

TOTAL CITATIONS

0

Scholarly Papers (3)

1.

Direct Microencapsulation of Ionic-Liquid-Based Shear Thickening Fluid Via Rheological Behavior Transition for Multifunctional Applications

Number of pages: 22 Posted: 29 Sep 2022
Hanshan Normal University, Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), South China University of Technology, South China University of Technology, South China University of Technology and Hong Kong University of Science & Technology (HKUST)
Downloads 58 (980,173)

Abstract:

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Shear thickening fluid (STF), ionic liquid, Microencapsulation, Rheological behavior transition, Impact resistance, Conductivity restoration

2.

Cell Membrane-Inspired Regulation of Reactant Diffusion for Active Agent Microencapsulation Via Sharp Interface Engineering

Number of pages: 34 Posted: 05 Mar 2024
Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), South China University of Technology and Hong Kong University of Science & Technology (HKUST)
Downloads 47 (1,097,529)

Abstract:

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sharp interface engineering, interfacial diffusion regulation, amine microencapsulation, CO2 reduction, instant PU adhesive

3.

Microcapsule Mechanics: Failure Modes and Mechanisms of Different Shells Under Compression

Number of pages: 30 Posted: 02 Dec 2023
Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST) - Department of Mechanical and Aerospace Engineering and Hong Kong University of Science & Technology (HKUST)
Downloads 47 (1,109,210)

Abstract:

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Microcapsules, Failure modes, Fracture, Buckling, FEM