70/30 Cu-Ni alloys, Banded segregation, Polarization Resistance, Ni2+ doping
70/30 Cu-Ni alloys, Banded segregation, Polarization resistance, Ni²⁺ doping
copper-nickel alloys, grain boundary engineering, Corrosion resistance, Electrochemistry
corrosion behavior, 70/30 CuNi alloys, Roughness, Elemental segregation, Stern model, Cu2(OH)3Cl
Corrosion behavior, 70/30 CuNi alloys, Roughness, Elemental segregation, Stern model, Cu2(OH)3Cl.
non-weighing micro-reaction IN718 ICP-OES superalloy
Residual stress, Neutron diffraction, X-ray diffraction, High-speed train wheel
Microwave heating, Metal powder, Interfacial reaction, mechanical alloying, microstructure
Flow-Induced Interfacial Acidification Affects the Surface Film Evolution and the Erosion Resistance of 90/10 Cu-Ni Alloy
90/10 copper-nickel alloy. Erosion-corrosion. Mass transfer. Pourbaix diagram. The film‑forming pathway. Interfacial microenvironment.
