Xu Chen

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Numerical and Experimental Study on Cooling High Power Chips of Date Centers Using  Double-Side Cooling Module Based on Mini-Channel Heat Sink

Number of pages: 24 Posted: 18 Oct 2022
Zeng Deng, Shunlu Zhang, Kefan Ma, Chunbo Jia, Yanqiang Sun, Yufeng Luo, Xu Chen, Baofeng Li and Tiejun Li
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Cooling, Data center, mini-channel heat sink, High Power Chip