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Kirak Son

Electronics and Telecommunications Research Institute

218 Gajeong-ro, Yuseong-gu

Daejeon, 305-700

Korea, Republic of (South Korea)

  • Electronics and Telecommunications Research Institute

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Scholarly Papers (1)

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Effect of Ald Al2o3 Passivation Layer Thickness on the Surface Treatment of Direct-Bonded Copper Substrates: Wetting, Oxidation, and Mechanical Property Analyses

Number of pages: 15 Posted: 07 Nov 2022
Kirak Son, Aesun Oh, Bongmin Jeong, Young-Bae Park and HYUNCHEOL BAE
Electronics and Telecommunications Research Institute, Electronics and Telecommunications Research Institute, Electronics and Telecommunications Research Institute, Andong National University and Electronics and Telecommunications Research Institute
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Abstract:

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Al2O3, atomic layer deposition, reflow, oxidation, Mechanical property