New Delhi
India
Inter-University Accelerator Centre
Tungsten carbide, SHI, Radiation damage, thermal spike
R F Sputtering, Gamma-irradiation, XRD, H2 gas sensor, recovery/response time
nickel silicides, Co-sputtering, Irradiation, annealing, Surface morphology, electrical resistivity
Carbyne, Nanoconstrictions, Graphene moiré patterns, Holey graphene, Hydrothermal cutting
MXene layer, sensor, Piezo-resistive, Triboelectric
Solvent casting, Dielectric constant, Plasticizing agent, Polymer electrolytes, Ionic conductivity, Nanocomposite.
Phase Change Memory, Sb2Te3, RESET current, Thermal stability, memoryswitching, Finite Element Method (FEM).