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Jiacheng Huang

Changzhou University

  • Changzhou University

SCHOLARLY PAPERS

3

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143

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Scholarly Papers (3)

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1.

Study on Electrodeposition of Gallium-Selenium Binary Alloy Films from Deep Eutectic Solvent

Downloads 69 (899,324)

Study on Electrodeposition of Gallium-Selenium Binary Alloy Films from Deep Eutectic Solvent

Number of pages: 21 Posted: 26 Apr 2024
Qihu Wu, Wenchang Wang, Jiacheng Huang, Zhiyao Ming, Minxian Wu, Pengju Wang, Naotoshi Mitsuzaki and Zhidong Chen
Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University and Changzhou University
Downloads 45 (1,157,169)

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deep eutectic solvent, Electrodeposition, Ga-Se alloy, co-deposition, Photoelectric property

Study on Electrodeposition of Gallium-Selenium Binary Alloy Films from Deep Eutectic Solvent

Number of pages: 20 Posted: 20 May 2024
Qihu Wu, Wenchang Wang, Jiacheng Huang, Zhiyao Ming, Minxian Wu, Pengju Wang, Naotoshi Mitsuzaki and Zhidong Chen
Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University and Changzhou University
Downloads 24 (1,459,262)

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deep eutectic solvent, electrodeposition, Ga-Se alloy, Co-deposition, Photoelectric property

2.

Effect of Deposition Potential on Electrodeposition of Sn-Ag-Cu Ternary Alloy Solderable Coating in Deep Eutectic Solvent

Number of pages: 15 Posted: 24 Apr 2023
Jiacheng Huang, Zhidong Chen, Qian Xiang, Shuiping Qin, Pengju Wang, Wenchang Wang and Naotoshi Mitsuzaki
Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University and Changzhou University
Downloads 45 (1,145,425)

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Deep eutectic solvent, Sn-Ag-Cu ternary alloy solderable coating, electrodeposition, thermogravimetric analysis, induced deposition

3.

Effect of Ansa as an Additive on Electrodeposited Sn-Ag-Cu Alloy Coatings in Deep Eutectic Solvents

Number of pages: 19 Posted: 29 Apr 2024
Jiacheng Huang, Wenchang Wang, Qihu Wu, Zhiyao Ming, Shuiping Qin, Pengju Wang, Naotoshi Mitsuzaki and Zhidong Chen
Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University, Changzhou University and Changzhou University
Downloads 29 (1,345,526)

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Deep eutectic solvent, electrochemical behavior, electrodeposition, additives, Sn-Ag-Cu ternary alloy