Hongwei Niu

Jiangsu University of Technology

China

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Asymmetric Growth of Cu6sn5 Intermetallic Compound in Cu/Sn/Cu Interconnection System Under the Vertical Ultrasonic Vibration

Number of pages: 18 Posted: 31 May 2023

Hongwei Niu, Hong Bian, Xiao Liu, X.G. Song and H.Y. Zhao

Jiangsu University of Technology, Harbin Institute of Technology, Jiangsu University of Technology, Harbin Institute of Technology and Harbin Institute of Technology

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