affiliation not provided to SSRN
Flake powder metallurgy, Submicron laminated composites, Thermal mismatch, HDI stress, Crack propagation.
Cu-Cr-Nb alloy, Cr2Nb precipitate, Multi-modal precipitate strengthening, In-situ reaction
coating temperature, palladium-coated copper wire, direct palladium coating, Bonding interface, Elongation, Diffusion
Layered CuCrZr alloys, Gradient heterogeneous interfaces, Strain partitioning, HDI strengthening, Crack propagation.
Copper matrix composites, Core-shell (TaTiCr)B2 particles, Adsorption energy, Interfacial energy