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Jinping Liu

affiliation not provided to SSRN

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A Cu-Ni-Ti Alloy with Excellent Softening Resistance Combined with Considerable Hardness and Electrical Conductivity Obtained by the Traditional Aging Process

Number of pages: 16 Posted: 18 Jul 2023
Yu Sun, Dongdong Lv, shengda Guo, Chengjun Guo, Jinping Liu and Jianbo Zhang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Jiangxi University of Science and Technology - Faculty of Materials Metallurgy and Chemistry, affiliation not provided to SSRN and Jiangxi University of Science and Technology - School of Materials Science and Engineering
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High temperature softening, Timeliness enhancement, Copper alloys, Nanoparticle precipitation phase, Alloying