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Liangxin Gui

affiliation not provided to SSRN

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Scholarly Papers (1)

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Jet Impingement Boiling Heat Transfer Performance of Refrigerant Hp-1 in Micro-Pin-Finned Surfaces for High-Power Chips

Number of pages: 33 Posted: 29 Jul 2023
Xiang Ma, Liangxin Gui, Gege Song, Chengyu Hu, Xiaoping Yang, Yonghai Zhang and Jinjia Wei
Xi'an Jiaotong University (XJTU), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU) and affiliation not provided to SSRN
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Abstract:

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HP-1, jet impingement boiling, Critical heat flux, high-power chips, Heat transfer enhancement