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Wei Li

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Scholarly Papers (1)

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Research on Silicon Wafer Surface Phase Under Ultra-Thin Slicing Process and its Etching Hindrance Behavior During Metal-Assisted Chemical Etching

Number of pages: 19 Posted: 05 Aug 2023
Wei Yongqiang, Huanlun Tong, Xiuhua Chen, Shaoyuan Li, Fengshuo Xi, Wei Li, Wenhui Ma and Yuanchih Chang
Kunming University of Science and Technology, Kunming University of Science and Technology, Yunnan University, Kunming University of Science and Technology, Kunming University of Science and Technology, affiliation not provided to SSRN, Kunming University of Science and Technology - The National Engineering Laboratory for Vacuum Metallurgy and University of New South Wales (UNSW)
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Abstract:

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Ultra-thin silicon wafer, Stress induced amorphous silicon, MACE, Inverted pyramid texturing