affiliation not provided to SSRN
Transient liquid phase (TLP) bonding, intermetallic phases, Failure mechanism, Microstructure-property correlations, 3D-FIB-SEM, Precipitation morphology
In-situ material testing, Electrical resistivity, Direct current potential drop (DCPD), Microstructural damage, Dislocation density, Electron channeling contrast imaging (ECCI)
Transient liquid phase bonding, diffusion brazing, stainless steel, Microstructure, Crack formation