default author photo

Dongfang Dai

Chongqing University

Shazheng Str 174, Shapingba District

Shazheng street, Shapingba district

Chongqing 400044, 400030

China

  • Chongqing University

SCHOLARLY PAPERS

2

DOWNLOADS

75

TOTAL CITATIONS

0

Scholarly Papers (2)

Actions:
Email selected abstracts
1.

1 Min Rapid Sintering of Copper Formate Coated Cu Nanoparticles for Power Electronic Packaging

Number of pages: 31 Posted: 06 Sep 2023
Dongfang Dai, Jing Qian, Jincheng Li, Yexiong Huang, Zeping Wang, Jiabing Yu, Xiao Wang and Xianping Chen
Chongqing University, Chongqing University, Chongqing University, Chongqing Normal University, Chongqing University, Chongqing University, Chongqing University and Chongqing University
Downloads 39 (1,222,651)

Abstract:

Loading...

Die attach, Sintered Cu, Cu-Cu joints, Electronic Packaging, Reliability

2.

One-Step Process of Wrinkle Microstructured Iontronic Pressure Sensor with All Fabric Wearable Electrode

Number of pages: 28 Posted: 15 May 2024
Kai Zheng, Xuan Yang, Dongfang Dai, Jincheng Li, Ku Shu, Mei-Dan Lou, Xianping Chen, Jiabing Yu and Yexiong Huang
Technical University of Denmark, Chongqing University, Chongqing University, Chongqing University, Chongqing University, Chongqing University, Chongqing University, Chongqing University and Chongqing Normal University
Downloads 36 (1,236,159)

Abstract:

Loading...

graded wrinkle microstructure, Pressure sensor, iontronic interface