Yuan Li

University of Science and Technology Beijing

30 Xueyuan Road, Haidian District

beijing, 100083

China

  • University of Science and Technology Beijing

SCHOLARLY PAPERS

2

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Scholarly Papers (2)

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1.

Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers

Number of pages: 24 Posted: 06 Oct 2023
Xiaofan Jiang, Zeming Tao, Yuan Li, Fangyuan Sun, Daquan Yu and Yi Zhong
Xiamen University, Xiamen University, University of Science and Technology Beijing, University of Science and Technology Beijing, Xiamen University and Xiamen University
Downloads 53 (839,439)

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Electronics packaging, thermal management, semiconductor die-attach, thermal boundary resistance

2.

Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

Number of pages: 28 Posted: 08 Nov 2023
Xiaofan Jiang, Zeming Tao, Yuan Li, Fangyuan Sun, Daquan Yu and Yi Zhong
Xiamen University, Xiamen University, University of Science and Technology Beijing, University of Science and Technology Beijing, Xiamen University and Xiamen University
Downloads 39 (961,885)

Abstract:

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electronics packaging, thermal management, semiconductor die-attach, thermal boundary resistance