default author photo

Hu Li

Kunming University of Science and Technology

Kunming Yunnan China

Kunming

China

SCHOLARLY PAPERS

3

DOWNLOADS

117

TOTAL CITATIONS

0

Scholarly Papers (3)

1.

Core-Shell Structured Ag@Sio2 Microspheres: A Promising Candidate for Electromagnetic Absorption

Number of pages: 17 Posted: 03 Jun 2024
Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 54 (1,020,567)

Abstract:

Loading...

Ag@SiO2, core-shell Structure, Electroless plating, Electromagnetic wave absorption

2.

Surfactants-Mediated Silver Deposition Behavior on Aluminum Particle Surfactants

Number of pages: 32 Posted: 27 Oct 2023
Kunming University of Science and Technology, Kunming University of Science and Technology, affiliation not provided to SSRN, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 35 (1,249,711)

Abstract:

Loading...

Electroless plating, Surfactants, Al@Ag core-shell particles, DFT calculation, Solid-liquid interface, Buffer layer

3.

Controlling Silver Deposition Morphology on Aluminum Surfaces: Surfactant Modify Anisotropy of Aluminum Surface Energy

Number of pages: 25 Posted: 11 Jan 2024
Kunming University of Science and Technology, Kunming University of Science and Technology, affiliation not provided to SSRN, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 28 (1,359,097)

Abstract:

Loading...

Surface energy anisotropy, surfactant, Al@Ag particle, Solid-liquid interface, Buffer layer