Yu-Xi Wang

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Micro-Cones Cu Fabricated by Pulse Electrodeposition for Solderless Cu-Cu Direct Bonding

Number of pages: 26 Posted: 31 Oct 2023
Minghui Zhang, Li-Yin Gao, Yu-Xi Wang, Wei Dong, N. Zhao and Zhi-Quan Liu
Dalian University of Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, affiliation not provided to SSRN, Dalian University of Technology, Dalian University of Technology - School of Materials Science and Engineering and Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology
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Abstract:

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Micro-cones Cu, Cu-Cu direct bonding, Plastic deformation, Microstructure, Bonding mechanism